ROHM NFC Chipset Powers Miniaturization Trend in Wearables
Event summary
- ROHM Semiconductor launched a new wireless power chipset (ML7670/ML7671) compatible with Near Field Communication (NFC) technology.
- The chipset is designed for ultra-compact wearables like smart rings and smart bands, addressing the limitations of Qi wireless charging in small form factors.
- The chipset achieves a maximum power transfer of 250mW with a power transfer efficiency of 45% in the low output range, in a 2.28 x 2.56 x 0.48mm form factor.
- SOXAI RING 2, launched December 10, 2025, is the first product to adopt the new ROHM chipset.
- The chipset incorporates embedded firmware, reducing board space and development workload.
The big picture
The demand for increasingly compact wearables, particularly smart rings for health and fitness tracking, is pushing the boundaries of existing wireless charging technologies. ROHM's chipset addresses a specific niche—ultra-small devices where Qi charging is impractical—and positions the company to capitalize on the growing trend of miniaturization in the wearable market. This move underscores the increasing importance of NFC technology in enabling new form factors and functionalities in consumer electronics.
What we're watching
- Market Adoption
- The success of ROHM's chipset hinges on broader adoption beyond SOXAI; other wearable manufacturers will need to prioritize NFC-based charging to enable further miniaturization.
- Competitive Landscape
- While ROHM highlights efficiency gains, competitors are likely developing similar solutions, and the long-term pricing dynamics will determine ROHM's market share.
- Ecosystem Growth
- The expansion of the NFC wireless power ecosystem will be crucial; increased compatibility and standardization will drive demand for ROHM's chipset and related components.
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