ROHM Semiconductor Launches Compact, High-Reliability MOSFET Package for Automotive Applications
Event summary
- ROHM Semiconductor introduced the HPLF5060 package (4.9mm × 6.0mm) for its automotive 40V/60V MOSFET lineup, addressing reliability challenges in miniaturized designs.
- The new package features gull-wing leads for enhanced board-mount reliability and copper clip junction technology for high-current operation.
- Mass production of the HPLF5060 package began in November 2025, with online sales through distributors like DigiKey and Farnell.
- ROHM plans to start mass production of the smaller DFN3333 (3.3mm × 3.3mm) package in February 2026 and is developing a TOLG (9.9mm × 11.7mm) package for high-power applications.
The big picture
ROHM's expansion of its automotive MOSFET lineup reflects the broader industry trend toward miniaturization and reliability in power semiconductor components. As electric vehicles and advanced driver-assistance systems drive demand for high-performance, compact solutions, ROHM's strategic move positions it to capture market share in the growing automotive semiconductor sector. The company's focus on innovation in packaging technology underscores its commitment to meeting the evolving needs of automotive manufacturers.
What we're watching
- Market Adoption
- How quickly automotive manufacturers will integrate the new HPLF5060 package into their designs, given its reliability and compact size.
- Competitive Response
- Whether competitors will accelerate their own developments in compact, high-reliability MOSFET packages to match ROHM's offerings.
- Technological Advancements
- The pace at which ROHM can scale production of the DFN3333 and TOLG packages, and their potential impact on the automotive semiconductor market.
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