Navitas Launches 5th-Gen SiC TAP Tech for AI Data Centers and Grid Infrastructure

  • Navitas Semiconductor unveiled its 5th-generation GeneSiC Trench-Assisted Planar (TAP) MOSFET technology on February 12, 2026.
  • The new platform delivers a 35% improvement in RDS,ON × QGD figure of merit (FoM) over previous generations.
  • Key reliability benchmarks include extended stress testing, dynamic switching reliability, and enhanced cosmic ray resilience.
  • The technology is targeted at AI data centers, grid and energy infrastructure, and industrial electrification.

Navitas' 5th-generation SiC TAP technology represents a significant leap in power conversion efficiency and reliability, positioning the company to capture market share in high-growth sectors like AI data centers and energy infrastructure. The launch underscores the strategic shift towards high-voltage applications, where Navitas aims to outperform established competitors with its proprietary trench-assisted planar architecture. The technology's focus on extended stress testing and dynamic switching reliability highlights the critical need for robust solutions in mission-critical environments.

Performance Gains
How the 35% improvement in RDS,ON × QGD FoM will impact switching losses and operational efficiency in high-voltage applications.
Market Adoption
Whether the enhanced reliability features will accelerate adoption in AI data centers and grid infrastructure.
Competitive Dynamics
The pace at which competitors will respond with comparable SiC technology advancements.