Amkor Technology, Inc.

Amkor Technology, Inc. is a global leader and one of the world's largest providers of outsourced semiconductor assembly and test (OSAT) services. Founded in 1968, the company's core mission is to serve as a strategic manufacturing partner for the world's leading semiconductor companies, foundries, and electronics OEMs, enabling them to bring innovative technologies to market. Amkor's corporate headquarters is located in Tempe, Arizona, U.S..

The company offers a comprehensive portfolio of outsourced packaging and test solutions for integrated circuits. Its services encompass package design and development, wafer probe and package test, wafer bumping and redistribution, package assembly, and final test. Amkor's product offerings include advanced packaging technologies such as flip chip, fine pitch bumping, wafer-level processing, advanced System-in-Package (SiP), 2.5D/3D integration, Through Silicon Via (TSV), MEMS, and power modules, alongside mainstream wirebond packaging. These solutions cater to diverse market segments including smartphones, data centers, artificial intelligence (AI), automotive, wearables, communications, computing, consumer electronics, industrial, IoT, and networking products.

In recent news, Amkor Technology reported record first-quarter 2026 net sales of $1.685 billion, marking a 27% year-over-year increase, driven by broad-based end-market demand. The company also announced a proposed offering of $1 billion in convertible senior notes due 2031 and authorized a $300 million share repurchase program. Amkor is expanding its advanced packaging and test facility in Arizona, supported by CHIPS funding, with new compute programs and the Arizona facility expected to ramp up in the second half of 2026. Kevin Engel serves as the President and Chief Executive Officer, appointed in January 2026. Amkor is strategically positioned as a critical component of NVIDIA's GPU supply chain and a key advanced packaging provider, particularly for AI and data center workloads.