Teledyne Unveils SCION Cameras to Reshape SWIR Imaging Market

MONTGOMERYVILLE, PA – January 20, 2026 – Teledyne Technologies has today introduced a new family of imaging systems poised to significantly impact the advanced vision market. Teledyne Judson Technologies, a core part of its imaging division, announced the launch of the SCION family of VIS–SWIR cameras, a new line designed to merge high-end performance with the high-volume production and cost-efficiency needed to expand into burgeoning commercial and scientific sectors.

The announcement positions Teledyne to capitalize on a rapidly growing market for Short-Wave Infrared (SWIR) imaging, a technology prized for its ability to see through materials opaque to the human eye and detect unique chemical signatures. By integrating decades of sensor expertise into a streamlined, powerful platform, the SCION family aims to make this advanced capability more accessible than ever before.

A Technical Leap in Sensitivity and Noise

At the heart of the SCION platform are significant technical advancements designed to push the boundaries of SWIR imaging. The cameras feature a modern 10-micron pixel pitch in high-resolution formats of 640x512 and 1280x1024. This smaller pixel size is in line with the industry trend toward higher-density imaging arrays for more detailed analysis.

More critically, the SCION family offers exceptional spectral flexibility through two proprietary sensor options. The first, leveraging Teledyne’s VisGaAs (Visible-sensitive Indium Gallium Arsenide) material, provides a broad sensitivity range from the visible spectrum out to 1700 nm. The second option utilizes MCT (Mercury Cadmium Telluride) sensors to cover the 900-2500 nm range, extending deeper into the infrared. This dual-material approach within a single product family is a key differentiator, allowing customers to select the optimal spectral range for applications from silicon inspection to chemical analysis without changing platforms.

Perhaps the most significant innovation is the camera's noise performance. SCION incorporates a Sample-up-the-ramp (SUPR) readout capability that enables sub-one-electron read noise with a one-second acquisition. This is a remarkable achievement in a commercial camera, as competitors often list read noise figures well above 20 or 30 electrons. Such low noise is crucial for applications where signals are incredibly faint, such as fluorescence measurement in biosciences or long-range observation for defense, allowing for the detection of details that would otherwise be lost in static.

“SCION reflects our ability to unite sensor manufacturing and camera system expertise within Teledyne to support evolving imaging applications,” said Paul Mark, Director of Infrared and Spectroscopy at Teledyne Judson Technologies. “By combining VisGaAs sensitivity with low‑noise, thermoelectrically cooled camera design and advanced readout modes, the SCION VIS–SWIR camera delivers a flexible platform for applications where performance, stability, and integration efficiency are critical.”

Navigating a Competitive and Growing Market

The launch comes at a pivotal time for the SWIR imaging industry. Market analysts project the global SWIR camera market to grow robustly, with some reports forecasting a compound annual growth rate (CAGR) exceeding 9% to reach over $500 million by 2030. This growth is driven by expanding use cases in industrial automation, medical diagnostics, precision agriculture, and security.

Teledyne enters a competitive field populated by established players like Xenics, Collins Aerospace's Sensors Unlimited, and Hamamatsu Photonics. However, SCION appears strategically positioned not merely to compete, but to redefine market segments. While high-end SWIR has traditionally been the domain of defense and specialized research, Teledyne's emphasis on cost-efficiency and a unified design suggests a push toward democratizing the technology.

By optimizing the manufacturing process and total cost of ownership, the SCION platform could lower the barrier to entry for commercial R&D labs, systems integrators, and industrial clients who previously found high-performance SWIR to be prohibitively expensive. This strategy aims to expand the addressable market, moving advanced imaging from a niche tool to a more broadly deployed industrial and scientific sensor.

The 'Pixel-to-PC' Advantage

The SCION launch is a clear manifestation of Teledyne's broader corporate strategy, built around a concept it calls the "Pixel-to-PC" architecture. This refers to the company's formidable vertical integration, which leverages the collective expertise of its many imaging-focused subsidiaries, including Teledyne DALSA, Teledyne e2v, and the recently acquired Teledyne FLIR. By controlling the entire value chain—from designing the sensor pixels to developing the camera electronics and software development kits (SDKs)—Teledyne can deliver a highly optimized and reliable solution.

For customers, this integrated approach promises tangible benefits. It simplifies the supply chain by providing a single point of contact for the entire imaging subsystem, reducing the technical and schedule risks associated with integrating components from multiple vendors. This unified design, where the sensor, vacuum package, and camera electronics are co-developed, ensures maximum performance and stability while streamlining the path from product development to market deployment. This strategy not only provides a competitive edge but also reinforces the company's claim of optimizing the total cost of ownership for end-users.

Unlocking Insights Across Key Industries

The true impact of the SCION family will be measured by the breakthroughs it enables across its target applications. The camera's combination of sensitivity, low noise, and spectral range makes it a powerful tool for a diverse set of challenges.

In hyperspectral imaging, a field expected to see a CAGR of over 15% in the coming years, SCION can provide the detailed spectral data needed for everything from precision agriculture and environmental monitoring to mineral identification and defense intelligence. For the semiconductor industry, the camera's ability to see through silicon is invaluable for detecting subsurface cracks and defects in wafers and solar cells, a critical step in quality control.

In biosciences and medical diagnostics, the sub-one-electron noise performance is a game-changer for fluorescence imaging, where detecting faint emissions can be the key to understanding cellular processes or identifying disease markers. The camera is also well-suited for traditional strongholds like space and defense, where its high sensitivity and ability to penetrate atmospheric obscurants like fog and smoke enhance surveillance, targeting, and Earth observation capabilities.

Teledyne will be demonstrating the SCION camera's capabilities at major industry events throughout the year, starting with SPIE Photonics West in San Francisco this week and followed by the SPIE Defense + Commercial Sensing Conference in National Harbor, Maryland, in April. These demonstrations will offer a first-hand look at a platform engineered to bring the hidden world beyond the visible spectrum into clearer focus for a wider audience than ever before.