IoT Manufacturing Reimagined with Quantum-Safe Factory Connectivity

BARCELONA, Spain – February 20, 2026 – A major shift in how Internet of Things (IoT) devices are manufactured and deployed was unveiled today at MWC Barcelona, as a trio of industry leaders launched a program designed to solve one of the sector's most persistent headaches: connectivity. IoT solutions provider Acceleronix, secure transactions giant IDEMIA Secure Transactions, and global connectivity specialist Tele2 IoT have joined forces to introduce the In-Factory Profile Provisioning (IFPP) Early Access Program. The initiative enables device manufacturers to embed operational, quantum-safe connectivity profiles directly onto eSIMs during the production process, allowing devices to leave the factory ready to connect immediately.

This move directly challenges the traditional, often cumbersome method of provisioning connectivity after a device has been shipped. By preloading profiles in a controlled factory environment, the partnership aims to dramatically simplify the IoT supply chain, accelerate time-to-market, and enhance the security posture of the next generation of connected devices.

A New Paradigm for IoT Manufacturing

For years, Original Equipment Manufacturers (OEMs) have grappled with the logistical complexities of deploying connected products globally. The conventional approach required managing numerous stock-keeping units (SKUs) for different regions and mobile operators, or relying on in-field, over-the-air (OTA) provisioning. This latter method, while flexible, introduces significant challenges. It can lead to unpredictable first-time connection experiences, especially in areas with poor network coverage, and consumes precious battery life—a critical issue for low-power IoT devices designed to operate for a decade or more on a single charge. Industry analysis suggests that an initial OTA profile download can drain as much as 15% of a device's battery capacity before it has even begun its primary function.

Furthermore, many modern manufacturing facilities operate in secure, air-gapped environments where internet access is restricted, making cloud-based OTA provisioning during production impossible. The IFPP model proposed by Acceleronix and its partners circumvents these issues entirely. It allows a single, global device SKU to be produced, with the appropriate connectivity profile loaded just-in-time based on the product's intended destination. This not only streamlines inventory and logistics but also guarantees that the device will connect reliably as soon as it is powered on in the field.

"Acceleronix is leading the industry with our IFPP- and SGP.32-enabled solution, our SIM orchestration, and our pan-regional IoT connectivity," said Gal Olshinka, Acceleronix Director. "This new IFPP Early Access Program demonstrates our commitment to eSIM technology and reflects our focus on streamlining the IoT device and connectivity lifecycle to support scalable IoT solutions."

Building a Quantum-Safe, Future-Proof Foundation

Beyond the immediate operational benefits, the program introduces a critical layer of forward-looking security. The solution is advertised as "quantum-safe," a term referring to cryptographic methods robust enough to withstand attacks from future quantum computers. This addresses the growing cybersecurity concern of "harvest now, decrypt later," where malicious actors intercept and store encrypted data today with the intent of decrypting it years from now when quantum computing becomes a reality. For IoT devices with lifespans exceeding a decade—common in industrial, automotive, and smart city applications—this long-term threat is a significant risk.

The inclusion of post-quantum cryptography, provided by IDEMIA Secure Transactions, ensures that the sensitive connectivity profiles are protected throughout the device's lifecycle, even within offline factory environments. This proactive security stance is crucial for protecting critical infrastructure and sensitive data transmitted by IoT devices.

This initiative is also carefully aligned with the evolution of industry standards. The solution is built to be compatible with the GSMA's SGP.32 specification, the current standard for remote SIM provisioning in IoT. More importantly, it is designed with an eye toward the forthcoming SGP.42 specification, which is being developed specifically to standardize in-factory profile provisioning. This ensures that OEMs investing in the program today are adopting a future-proof technology that will remain compliant and interoperable as the industry landscape matures.

"IFPP marks a turning point for OEMs to significantly simplify and optimize the manufacturing process for connected devices," added Philippe De Oliveira, Senior VP Auto/IoT Connectivity Services at IDEMIA Secure Transactions. "By bringing together our expertise in connectivity solutions, in particular eSIM SGP.32, and our quantum-safe cryptography... we are proving - in-factory provisioning – which is not theoretical -- it is live, scalable, and ready for industrial adoption today."

A Strategic Alliance Forging a New Standard

The strength of the IFPP Early Access Program lies in the synergy between the three partners, each bringing a crucial piece of the puzzle. Acceleronix provides the overarching platform, factory tools, and orchestration capabilities required to integrate the provisioning process seamlessly into manufacturing workflows. IDEMIA Secure Transactions contributes its deep expertise in secure element technology, delivering the IFPP-ready eSIMs and the quantum-safe cryptographic binding that protects the MNO profiles. Finally, Tele2 IoT supplies its managed global IoT connectivity, providing the actual network profiles that enable devices to connect reliably across the world.

This tripartite collaboration creates a holistic, end-to-end solution that addresses the entire connectivity lifecycle from factory to field. It moves beyond theoretical concepts to offer a tangible, scalable system demonstrated live at MWC26.

"Tele2 IoT is proud to collaborate with Acceleronix and IDEMIA Secure Transactions to bring this IFPP Early Access Program to life," stated Onur Kasaba, Managing Director of Tele2 IoT. "By combining our managed global IoT connectivity and provisioning capabilities with in-factory profile provisioning, we're enabling OEMs to ship devices that are ready to connect straight from the factory."

The Road to Adoption: Opportunities and Hurdles

The primary drivers for OEM adoption are clear: significant reductions in operational complexity, faster time-to-market, and the assurance of secure, reliable, out-of-the-box connectivity. The promise of a single global SKU is a powerful incentive for any manufacturer struggling with the high costs and logistical friction of regional product variations.

However, the path to widespread adoption is not without potential obstacles. Integrating a new provisioning system into highly optimized manufacturing lines can present technical and financial challenges. OEMs will need to weigh the initial investment in new tooling and process adjustments against the long-term ROI. Concerns about committing to a specific vendor ecosystem, even one as comprehensive as this partnership, may also arise as manufacturers value flexibility in their supply chains.

To address these concerns and accelerate adoption, the partners are launching the initiative as an "Early Access Program." At MWC Barcelona, they are offering live demonstrations and providing trial kits to interested OEMs and device manufacturers. This hands-on approach allows potential customers to validate the technology within their own operational context, assess the integration effort, and experience the benefits firsthand before making a full-scale commitment. This strategy aims to build confidence and prove that the era of factory-provisioned, quantum-safe IoT connectivity has officially arrived.