FotoNation & SEMIFIVE Forge Alliance for Next-Gen Edge AI Chip

GALWAY, Ireland, and SEOUL, South Korea – May 11, 2026 – In a significant move to reshape the future of on-device artificial intelligence, Irish AI innovator FotoNation and South Korean custom semiconductor giant SEMIFIVE have announced a strategic collaboration. The partnership will see SEMIFIVE lead the turnkey development of FotoNation's TriSilica, a new family of ultra-low-power perceptual AI chips designed to bring sophisticated intelligence to the network's edge.

This alliance leverages the unique strengths of three industry leaders: FotoNation's advanced perception IP, SEMIFIVE's renowned platform-based SoC design capabilities, and the cutting-edge manufacturing prowess of Samsung Foundry. The goal is to accelerate the commercialization of sensor-fusion Systems-on-Chips (SoCs) that could power the next wave of smart devices, from automotive systems to consumer wearables.

Redefining On-Device Intelligence

At the heart of this collaboration is FotoNation's TriSilica platform, an ambitious architecture designed to process a wide array of sensory data with extreme efficiency. Unlike cloud-based AI that requires constant connectivity and introduces latency, TriSilica is engineered for the edge. It supports multimodal inputs—including audio, mmWave radar, spectral imaging, infrared, and traditional RGB video—processing them directly on the device.

This capability is built upon FotoNation's foundational TriSense™ IP core, a technology already embedded in more than 4 billion products worldwide. The company's core philosophy is to eliminate unnecessary data before the AI inference process even begins, a crucial step in minimizing power consumption. The TriSilica chip family represents the next evolution of this principle, translating the proven TriSense architecture into production silicon with the addition of industry-first high-capacity bonded memory.

The result is a platform poised to enable devices that can perceive, adapt, and act in real-time under severe power constraints. In a market increasingly concerned with data privacy and responsiveness, processing information locally without sending it to the cloud is a powerful differentiator. This approach is critical for applications where latency can be a matter of safety, such as in a vehicle's driver-assistance system, or where battery life is paramount, as in a health-monitoring wearable.

A Strategic Alliance Forged in Silicon

The partnership structure is designed for rapid execution. SEMIFIVE will provide a comprehensive 'turnkey development' solution, a model it has pioneered to make custom silicon more accessible. This service covers the entire journey from initial specifications to mass production, significantly reducing the cost, risk, and time-to-market typically associated with developing custom chips.

"Our partnership with SEMIFIVE and its custom semiconductor capabilities will be a core driver for commercializing FotoNation's next-generation, ultra-high-performance, low-power sensor-fusion SoCs," said Petronel Bigioi, CEO of FotoNation. "We expect this collaboration to become a major turning point in advancing image processing and sensor-fusion technology to meet the demands of the rapidly growing edge AI market."

A decisive factor in the deal was SEMIFIVE's deep expertise in high-complexity, low-power integrated circuit (IC) design and advanced packaging. As one of Samsung Foundry's fastest-growing SAFE™ Design Solution Partners, SEMIFIVE brings extensive experience with advanced manufacturing processes. The first product from this collaboration, the TS-210, will be manufactured using Samsung Foundry's 8nm Low Power Ultimate (8LPU) process, a technology optimized for the power efficiency and performance density required by demanding edge AI workloads.

SEMIFIVE's European Gambit in the Global AI Race

This collaboration is not just a technical milestone; it is also a significant strategic move for SEMIFIVE. The deal with FotoNation marks the company's first major project in Europe, serving as a powerful anchor for its expansion into the continent's burgeoning semiconductor landscape. Having already established a strong presence in the United States, China, Japan, and India, this entry into Europe solidifies SEMIFIVE's position as a global force in custom AI silicon.

"FotoNation is a pioneer in in-device computational imaging solutions, and its Vision AI technology is redefining what is possible at the edge," stated Brandon Cho, CEO and co-founder of SEMIFIVE. "This partnership reinforces SEMIFIVE's technical leadership and serves as a strategic anchor for our expansion across the European semiconductor landscape."

The timing is critical. The global market for edge AI chips is projected to explode, with some estimates forecasting it to surpass $11 billion by 2031. This growth is fueled by the proliferation of IoT devices and the need for localized, real-time processing. While the market features established giants like NVIDIA, Qualcomm, and NXP, there is a massive opportunity for specialized Application-Specific Integrated Circuits (ASICs) like TriSilica that are purpose-built for power efficiency and performance in specific tasks. By joining forces, FotoNation and SEMIFIVE are positioning themselves to capture a significant share of this high-growth segment.

Powering the Next Wave of Intelligent Devices

The potential applications for the TriSilica chip family are vast and transformative. In the automotive sector, the chip's ability to fuse data from cameras, radar, and other sensors in real-time is crucial for developing more reliable Advanced Driver-Assistance Systems (ADAS) and autonomous driving platforms. In industrial settings, it can power predictive maintenance systems on factory floors, analyzing vibrations and sounds to prevent equipment failure.

For the consumer, this technology promises smarter homes where devices respond more intuitively and securely, as well as next-generation wearables and AI companions that offer advanced features without daily charging. The initial product, the TS-210, is already on a fast track, with a Multi-Project Wafer (MPW) shuttle scheduled for the end of this year. This concrete step demonstrates the serious commitment and rapid pace of the collaboration.

Both companies are well-capitalized to execute this ambitious vision. FotoNation recently closed a Pre-A funding round to accelerate TriSilica's development, while SEMIFIVE, backed by over $147 million in funding and heading towards a major KOSDAQ listing, has the financial muscle to scale its global operations. This combination of groundbreaking technology, strategic partnership, and solid financial footing sets the stage for a powerful new player to emerge in the global AI semiconductor market.